| 2007 Press Releases |
Press Releases from our manufacturers.
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Blue Planet Designs Ramtron Processor Companions Into Smart Retrofit Diesel Particulate Filters (DPF)
F-RAM Replaces EEPROM for Reliable Data Logging in Stringent Automotive Environments
COLORADO SPRINGS, CO--(MARKET WIRE)--Nov 27, 2007 -- Ramtron International Corporation (NasdaqGM:RMTR - News), a leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, today announced that Blue Planet Co. Ltd., a leading Korean supplier of retrofit diesel particulate filter (DPF) systems and diagnostic modules, has designed Ramtron's FM3130 and FM3104 Processor Companions into its DMS-series retrofit DPF data loggers.
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The FM3130 incorporates 64-kilobit (Kb) of F-RAM memory with an enhanced real-time clock (RTC) and highly integrated support and peripheral functions for processor-based systems. F-RAM has replaced EEPROM in DMS-series DPF systems, where the combination of F-RAM and an RTC is ideal for intensive data collection and storage of vehicle exhaust temperatures, system back pressure, and time logs. Ramtron's 4Kb FM3104 Processor Companion is also designed into the DMS-series, where the F-RAM + RTC are used as a buffer memory that writes to a secure digital (SD) card, which stores exhaust temperature profiles and other parametric data.
"We have opted for F-RAM instead of EEPROM on our advanced retrofit DPF data loggers to extend write endurance and improve overall system reliability in a harsh engine environment," says Blue Planet CEO, Kyung-Woon Kim. "The combination of the RTC and the F-RAM on the FM3130 has also enabled us to reduce component count and board space."
"The fact that a company such as Blue Planet, which has close to 65 percent of Korea's retrofit DPF market, has chosen F-RAM is a testament to F-RAM's reliability in stringent automotive environments," says Craig Taylor, Ramtron Technical Marketing Director. "F-RAM's fast writes and high endurance combined with an enhanced RTC are ideal for such demanding applications."
Diesel particulate filters remove particulate matter in diesel engine exhaust. Via a catalytic chemical reaction, the filter burns off trapped materials, essentially cleaning or "regenerating" itself. The DPF requires intensive data logging to generate an exhaust temperature and pressure profile. The profile is based on sets of exhaust temperature and pressure variables versus time logs and is used to diagnose which kind of filter and catalyst the target equipment needs -- a passive regenerating filter or an active regenerating filter. The data logging, performed by Ramtron's F-RAM Processor Companions, must be extensive enough to provide a valid representation of the variety of situations in which the equipment is used.
Particles emitted by diesel engines have raised both health and environmental concerns worldwide. In response, countries such as the United States, the European Union, South Korea, and Japan have established emission limits for diesel engines. To date, more than 200,000 diesel vehicles worldwide have been retrofitted with a DPF and about half a million such vehicles are expected to be retrofitted by 2010.
Winbond USB Audio Controller Chip Speeds Skype VoIP Products To Market (electronicdesign.com article)
SAN JOSE, CA – (September 27, 2007) -
One of the fastest growing Internet services is digital telephony. Better known as voice over Internet Protocol (VoIP), it lets users make phone calls over the Internet rather than through their usual telephone company connection.
With over 220 million subscribers worldwide, Skype is the largest VoIP service provider. In the U.S., the cable TV industry is the second major supplier of VoIP, with Vonage in second place. If you make a lot of phone calls, especially foreign calls, you can save big bucks with one of these services.
Skype has made VoIP cheap and easy to use, but you need to call from your PC or laptop. You need speakers and a microphone, of course, which are standard features in most new laptops. In older or newer computers, you can use a headset. Now, Winbond Electronics' W681308 audio controller will make it easy for vendors to create different forms of VoIP phones that can connect to your USB port.
According to the company, designers can use this single-chip Skype phone to create a USB phone handset, a USB cordless phone, a speaker phone, or even a headset. Other possibilities include a dual-mode USB/PSTN (public switched telephone network) phone, a USB analog telephone adapter (ATA), and a USB PSTN gateway.
The W681308 includes the voice codecs for conversion, an embedded controller, and a variety of interfaces. The codec uses 16-bit analog-todigital and digital-to-analog converters (ADCs and DACs) with selectable sampling rates of 8/16/48 kbits/s providing very high-quality audio.
Acoustic echo cancellation (AEC) and automatic gain control (AGC) support the speaker-phone application. Otherwise, full-duplex echo cancellation, a three-channel mixer, an integrated microphone amplifier, and a speaker driver are standard.
The 8051 embedded controller can run at 12/24/48 MHz and includes an 8-kbyte one-time programmable (OTP) ROM and 1-kbyte RAM. A full USB 2.0 interface is provided. A serial peripheral interface (SPI) supports external flash or an LCD, while a general-purpose I/O (GPIO) interface is available for a keyboard.
The chip does not include the usual voice compression and Simple Internet Protocol (SIP) typical of other VoIP voice chips. The W681308 puts the digitized voice into standard pulse code modulation (PCM) format at either 64 or 128 kbits/s and sends it by the USB port to the PC, where Skype software takes care of the compression and implements its special proprietary protocol.
The W681308 comes in a 48-pin leadless quad flat package (LQFP) and costs $1.80 in 10,000-unit quantities. A full software development kit with 8051-based Keil C development system is also available.
Ramtron extends capability of nonvolatile state saver family with new 4-bit products
COLORADO SPRINGS, CO – (September 20, 2007) -
The FM111x retains logic states without power and restores outputs automatically upon power up. The state saver:
- Provides continuous access to nonvolatile system settings without reading a memory
- Enables storage of signals that may change frequently and without notice
- Allows nonvolatile storage of system settings without the system overhead of a serial memory
Read the full news announcement
More information on the:
- FM1110: Operates at 5V with a low standby current of less than of 10µA and an unlimited number of state changes
- FM1112: Operates at 3 volts with a low standby current of less than of 10µA and an unlimited number of state changes
- FM1114: Ultra low power device with standby current of less than .5µA for portable, battery-powered, and low-power system
- Download an FM111x datasheet: FM1110, FM1112, FM1114
- Visit our Nonvolatile State Saver page for more state saver products
- Contact an Focus about how F-RAM can help solve your design challenges
- Request a sample of the nonvolatile state saver
GSI Technology Announces 144Mb NBT™ SRAMs
Now Offering the Highest Density Pipelined and Flow Through No Bus Turnaround SRAMs
Santa Clara, Calif., September 4, 2007—GSI Technology (Nasdaq: GSIT) today announced the availability of its 144Mb NBT™ (No Bus Turnaround) SRAM that supports back-to-back Read/Write operation with no wait states. Typical applications include high performance network and communication equipment. The new 144Mb devices are currently the highest density offered by any manufacturer.
The 144Mb devices offer operating speeds of 2.3 ns in Pipeline mode and 5.5 ns in Flow Through mode, making them as fast as lower density devices. Available in x18 and x36 bus widths—which are most common for current network processor applications—and a choice of 1.8 V/2.5 V or 2.5 V/3.3 V supply voltage in a standard 14 mm x 22 mm 119-ball BGA package. Built utilizing GSI’s master die design technique and ExactPreference™ back-end manufacturing process, all versions are available with very short lead times.
"GSI Technology’s NBT product portfolio is the largest in the industry with six different densities in x18, 32, 36 and 72 bit widths” said David Chapman, Vice President of Marketing & Applications Engineering. “No matter the density or organization, we have exactly the right part for the application.”
Availability GSI Technology’s 144Mb NBT products are sampling now. Pricing for the GS8128Z18B in 1,000 piece quantities is $195. For more information on the 144Mb NBT go to http://www.gsitechnology.com/NBT_144Mb.htm.
About GSI Technology Founded in 1995, GSI Technology, Inc. is a leading provider of high performance SRAMs primarily incorporated in networking and telecommunications equipment. Headquartered in Santa Clara, California, GSI Technology is ISO 9001 certified and has world-wide factory and sales locations.
Central introduces new 1Amp, 100Volt Schottky Bridge Rectifier in the very small HD DIP package
Hauppauge, NY USA - July 21, 2007 - Central Semiconductor Corp. announces the release of the CBRHDSH1-100, 1 Amp, 100 Volt Schottky Bridge Rectifier. The CBRHDSH1-100 is ideal for both first and second generation Power over Ethernet (PoE) designs, as well as general purpose full wave rectification and reverse polarity protection applications. With a typical VF of 0.7V at 1 Amp, this device is well suited for portable battery and high efficiency applications such as: modems, routers, portable test equipment, and LED lighting systems.
The two main advantages of this new Schottky Bridge are reduced size and energy efficiency. The HD DIP utilizes 50% less board space than 4 individual SMA rectifiers in a bridge configuration. In terms of energy efficiency, the CBRHDSH1-100 uses 36% less energy to perform the same function as a standard bridge rectifier.
The CBRHDSH1-100 is available Bulk Packed or 3,000 pcs on 13” Tape & Reel. Prices for the CBRHDSH1-100 start at $0.48 each for 3,000 pcs on a 13” reel. Sample devices are available upon request.
CBRHDSH1-100 
1 Amp, 100 Volt Schottky Bridge Rectifier
Teridian Unveils World’s First Single-Package FXO Solution
Optimized for Multi-Port FXO Applications Targeting Small and Medium Enterprise VoIP Equipment
Irvine, Calif., June 11, 2007 –Teridian Semiconductor Corp. today introduced two new devices in its networking product portfolio, the 73M1866 and 73M1966 devices. These devices draw from experience gained by deploying 130 million networking ports worldwide, and from Teridian’s innovative MicroDAAä technology. With this innovative approach in addressing the Foreign-Exchange-Office (FXO) function, these two solutions facilitate superior voice quality and significant bill of materials cost reductions in business critical and residential Voice-over-IP (VoIP) applications. The 73M1866 and 73M1966 are ideally suited for “PSTN lifeline” support for VoIP Equipment, small and medium enterprise integrated service routers, converged media gateways, analog telephone adapters, VoIP – PBX, and residential/CPE gateways. The “PSTN lifeline” function provides telephony service for business continuity and access to Emergency 911 in the event of a VoIP equipment failure.
The Teridian 73M1866 is a single-chip solution that uses Teridian’s unique MicroDAAä or data access arrangement (DAA) function designed exclusively for FXO of Voice-over-IP (VoIP) systems. The device provides the majority of the circuitry to connect PCM- formatted voice channels to a PSTN via a two-wire, twisted-pair interface. This single 8mm x 8mm QFN package provides best-in-class return loss, EMI and Common Mode noise performance, resulting in superior voice quality. The ability to support host-side power makes the device independent of PSTN loop variations, generating robust performance in any deployment environment. The solution uses an inexpensive common pulse transformer that forms a digital isolation barrier, transferring both power and data to the PSTN line side components. This technology is also available for extended isolation requirements as a chip set, 73M1966. The result is reliable performance in the presence of EMI and line voltage variations.
“Designed specifically for VoIP customer premise equipment, Teridian has significantly reduced bill of materials cost for our FXO customers,” said Steve McClure, vice president of marketing for Teridian Semiconductor. “The 73M1866 and 73M1966 solutions provide programmable global compliance, leveraging more than fifteen years of SiDAA experience.”
The Teridian family of modems provides one of the broadest selections of semiconductor products for today’s set-top box, point-of-sale (POS) terminals, multi function fax and voice band data modem applications, and the company’s extensive firmware libraries and reference designs significantly shorten development and certification time. Teridian is a Silicon DAA technology pioneer and patent holder with a long history of development and innovation, including the capacitive isolation barrier technology licensed to third parties. The technology has been globally deployed in low-speed and high-speed analog modems.
Pricing and Availability
Volume production for the 73M1866 and 73M1966 solutions are expected this month; pricing is available upon request. Data sheets and development kits for both devices are also available now, and include a ready-to-use board with an actual 73M1866 or 73M1966 IC, with firmware and software libraries, and a reference design. For additional information, contact any Teridian sales representative, authorized worldwide distributor, or visit Teridian’s Web site at http://www.teridian.com/sales.
About Teridian Semiconductor
Teridian Semiconductor Corporation brings intelligence and integration to real-world designs. The company’s best-in-class analog and mixed-signal integrated circuits play a primary role in energy and automation, networking, and secure access applications. Teridian solutions can be found in smart card readers, VoIP gateways, set-top boxes, point-of-sale equipment, utility meters and factory floor automation across the globe, enabling customers to get to market quickly with advanced applications that are tailored to meet the specific needs of their target markets. For more information, visit http://www.teridian.com.
Rockwell Collins names Central Semiconductor the “Discrete Semiconductor Commodity Supplier of the Year 2007”
Hauppauge, NY USA – June 5, 2007 – Central Semiconductor Corp., Hauppauge, NY was named “Discrete Semiconductor Commodity Supplier of the Year 2007” by Rockwell Collins. The award was presented by Chairman, President and CEO Clay Jones to Central Semiconductor’s Sales Manager Joseph Beck during the Annual Supplier Conference on April 18th in Cedar Rapids, IA.
The Supplier of the Year award is an acknowledgement of significant contributions made during the year by Rockwell’s suppliers and is based on total performance including, quality, delivery, and customer service.
Rockwell Collins is a pioneer in the development and deployment of innovative communications and aviation electronics solutions for both commercial and government applications. The company’s expertise in flight deck avionics, cabin electronics, mission communications, information management and simulation and training is strengthened by 17,000 employees and a global service and support network that crosses 27 countries. To find out more, please visit www.rockwellcollins.com
Jennic goes mainstream by significantly reducing pricing on ZigBee™ and IEEE 802.15.4 development kits
Change in tool pricing places one of the most powerful single chip Zigbee/IEEE802.15.4 platforms within reach of any developer or OEM
Sheffield, U.K.. - (May 9, 2007) – Jennic, Ltd., provider of one of the most powerful single chip wireless microcontrollers for IEEE 802.15.4 and ZigBee applications today announced new significantly reduced pricing on its ZigBee and IEEE 802.15.4 development kits. The new pricing is designed to lower barrier of entry in the ZigBee/IEEE 802.15.4 space and make it cost effective for OEMs to equip entire engineering teams with tools for wireless product development. The move comes after the distribution of over 1,000 kits since the rollout of the world’s first single chip wireless microcontroller solution in this space in December 2004 and the release of a second generation chip, the JN513X series of products, this January.
Jim Lindop, CEO of Jennic, Ltd. stated, “Jennic has established itself as a leader in the ZigBee/IEEE 802.15.4 space with our single chip wireless microcontrollers, complete with software tools and the entire support library available free of charge via web download from our support site. Now we’re the first company to offer a fully featured five node ZigBee development kit for under $500. This announcement is based on much feedback from our OEM customer base wishing to move to provide entire engineering teams with our development hardware to reduce time to market. The obvious benefit is this places our kits within range of smaller companies wishing to enter the ZigBee/IEEE 802.15.4 market as OEMs or third party developers.”
Glen Allmendinger, president and founder of Harbor Research added, “Jennic has established itself as a successful first mover in this space, continuously delivering its products ahead of schedule. The first generation single chip product was delivered in 2004, ten months before the next single chip offering, with the latest JN513X reaching the market almost six months earlier than it had projected in our briefings. The new pricing indicates the company has the product and support maturity to handle customers by the thousands rather than hundreds. We believe the development conversion rate for its tools sold in America exceeds 80 percent. Its new low cost development tools seem to feature capabilities normally associated with higher priced development environments; together with sub $3 parts and a viable roadmap to sub $2, this could signal an inflection point in the uptake of ZigBee/IEEE 802.15.4 technology.
To find a distributor to obtain the kits go to http://www.jennic.com/sales/index.php or www.digikey.com .
RAMTRON: AMI booms! News from Metering International magazine…
Reno, NV, USA -- (March 21, 2007)
While interest in AMI is growing across the globe, the rapid developments taking place in the U.S.A. would appear to put it in a boom phase. According to a recent review of announcements of large AMI deployments (greater than 100,000 endpoints) in electricity, water and gas there was a more than 200 percent increase in 2006 over 2005 levels. And for 2007 a further increase of 25 percent over 2006 levels is projected, driven by large utilities such as Southern California Edison (SCE), which plans to rollout some 5 million meters, DTE Energy with 4 million meters and San Diego Gas & Electric Company (SDG&E) with 2.3 million meters, among others.
At the same time, and as a consequence of these activities, significant changes are also taking place in the meter market place. Within the next few months the appearance of a new generation of meters is expected from the major meter manufacturers as well as new entrants, with ‘advanced’ features such as an integrated remote connect and disconnect service switch, remote upgradeability, and more memory. And developments are ongoing on enhanced network communication capabilities, including two-way communications to premise devices.
This is according to SCE, whose AMI initiative is noteworthy for its extensive involvement of the industry to refine the future vision and to develop the products to meet future requirements. In a feature in the latest edition of Metering International AMI program director Paul de Martini and program lead architect Jeff Gooding describe how by focussing on the customer and supporting an open innovation approach, SCE’s AMI business case could be developed positively.
“By taking the customer’s perspective it is possible to focus on the innovations that are believed to yield the right blend of customer benefit, utility efficiency and technologies necessary to optimise customer value,” write De Martini and Gooding.
Furthermore, SCE’s AMI Final Feasibility Report (released January 2007) comments that the Phase 1 process to confirm the technical and financial feasibility of the solution, projected to take 18 months, was completed in 13 months, and that prototype ‘new generation’ AMI residential and commercial meters are already in hand.
AMI is clearly at an exciting stage of development and over the next decade the utility industry will be making significant investments into it. And thus the imperative to “do it right,” as De Martini and Gooding write in the case of SCE, must be recognised by all the participants.
With such rapid evolution, what are my options? What is the business case for AMI strategies? How is the CIS going to manage and leverage the data? What is the role of AMI in the smart grid of the future? And how should large-scale rollout be managed? Answers to these and other questions from the pioneers of AMI will be offered at the 8th Metering, Billing/CIS America in San Antonio, Texas from May 7-11, which seeks to provide the integrated smart metering, billing and CIS toolkit for the NOW utility.
For additional information visit www.meteringamerica.com , email:
jimina@spintelligent.com or call 888 559 8017
RAMTRON UNVEILS INDUSTRY’S FIRST 4-MEGABIT NONVOLATILE FRAM MEMORY
New parallel FRAM device combines Texas Instruments’ proven 130 nanometer process with Ramtron’s advanced FRAM cell architecture
COLORADO SPRINGS, CO – (March 12, 2007) – Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of nonvolatile ferroelectric random access memory (FRAM) and integrated semiconductor products, today launched the semiconductor industry’s first 4-megabit (Mb) FRAM memory – the highest-density FRAM product, with quadruple the FRAM memory capacity available to date. The FM22L16 is a 4Mb, 3-volt, parallel nonvolatile RAM in a 44-pin thin small outline plastic (TSOP) package that features fast access, virtually unlimited read/write cycles and low power consumption. Pin-compatible with asynchronous static RAM (SRAM), the FM22L16 targets industrial control systems such as robotics, network and data storage applications, multi-function printers, auto navigation systems and a host of other SRAM-based system designs…. Read more at http://www.ramtron.com/doc/News/Release_detail.asp?ID=238
EETimes features Ramtron-TI partnership and new 4Mb FRAM device:
Ramtron and Texas Instruments Advanced FRAM Technology to 130nm Process
Texas Instruments and Ramtron Advance FRAM Technology to 130-Nanometer Process
Ongoing Collaboration Includes Production of World’s First 4-Megabit Nonvolatile FRAM Featuring the Highest Density Available
DALLAS (March 12, 2007) -- Texas Instruments (TI) (NYSE: TXN) and Ramtron International Corporation (Nasdaq: RMTR), a leading supplier of nonvolatile ferroelectric random access memory (FRAM) and integrated semiconductor products, announced a significant milestone in the development of FRAM technology that has resulted in a commercial manufacturing agreement for FRAM memory products. The agreement provides for the production of Ramtron’s FRAM memory products on TI’s advanced 130- nanometer (nm) FRAM manufacturing process, including Ramtron’s 4-Mb FRAM memory announced concurrently in a separate press release…. Read more at http://www.ramtron.com/doc/News/Release_detail.asp?ID=239